If your application requires limits in Electromagnetic Interference (EMI) and/or Radio Frequency Interference (RFI), shielding may be required. Shielding may be needed to protect the environment from the device as well as protect the device from the environment. All Flex offers several options for EMI/RFI shielding; the best option will depend on a number of factors including conductivity requirements, degree of flexing, and overall configuration.
Solid Copper is the most common method of shielding. Solid copper shields increase the rigidity of the circuit, and should be included in thickness to bend radius ratios when designing a flex circuit. Copper shields can be put on one or both sides of the circuit and can also cover selective conductors.
A modified copper or silver shield that relieves much of the shield areas by the use of a pattern. Crosshatching helps the circuit retain its flexibility and can be put on one or both sides. Crosshatch shielding can also cover selective conductors.
Silver can be screen printed onto the surface of a flex circuit as a substitute for the copper shielding in some applications. Openings in the coverlay dielectric allow grounding contacts. Silver shielding is not recommended for a dynamic flexing application as it is more brittle than alternative materials. Silver can be a solid or crosshatched shield and can be put on one or both sides of the circuit.
Tatsuta is a metalized film with a conductive adhesive coating that is thermally bonded to the flexible circuit. Selective openings in the coverlay film allow the conductive adhesive to electrically contact the flex circuit. This creates a shielding layer by the contact between the metalized film and the ground traces. It can also cover selective conductors.
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